Storage components

 

Vacuum packing machine

Vacuum packaging is a system of preservation and storage of electronic components and products, involving the removal of air from the container in which the product to be packaged is located. The devices ensure hermetic sealing of electronic devices, printed circuit boards and other sensitive components into DRY-SHIELD ESD / EMI packaging. The goal is to protect the packaged goods against oxidation, moisture, external damages and static electricity.

Our Client is assured, that after finishing the production, components sensitive to moisture and electrostatic discharge, which have not been fully used, are vacuum-packed and stored in optimal conditions.

Dry Cabinet 60°C

Desiccation and storage under the appropriate conditions of moisture sensitive electronic devices (MSD) is becoming an essential requirement in the process of electronic components storing, due to the using of materials with hygroscopic structure.

Our company has a fully automated “plug and play” drying chamber, with heating providing a stable condition of 60°C and <1% RH

The possibility of heating the inside of the climatic chamber, along with low humidity, creates the conditions for storing sensitive components in accordance with the requirements of J-STD-033B standard.

Heating of components

It is well known that components such as QFP or BGA belong to the MSD group, but also LEDs or ordinary ceramic capacitors are exposed to risk of excessive humidity. Therefore, in order to maintain the highest quality of components, we have a drying oven, in which all MSD components can be not only safely stored, but also quickly and ‘gently’ dried, without creating hazards to the production process. Storage in a dry air  offers at the same time an optimal antioxidant protection.

 

Production Line

 

nordPick&Place Machine

The latest generation of the machine – the Japanese i-PULSE (Yamaha group) M20, with a capacity of 23000 cph, according to IPC 9850. It has a wide range of components from 01005 (inches) to 120 x 90mm, BGA, μBGA, TQFP. The machine is adapted to perform the role of the LED-Placer. Smart design allows the assembly of SMD components (including LEDs) on the PCB with a length of up to 1480 mm. This is a unique option in this class of machines. The M20 has a new generation of very fast and accurate Multi-Scan camera (High Speed & High Accuracy Fixed Camera). For the first time, it is possible that all SMD components, that are assembled by the machine, are processed by only one camera. Thanks to the high speed of image capture, the production process takes less time. The machine has 144 8mm feeder banks, which enables the assembly of modules with a large variety of components.

nord

Inline stencil printer

SP710 printer is equipped with the Automatic Dispense unit (ADu). The ADu can be fitted with any combination of paste and glue module, allowing you to cover all applications, which allows eliminating additional capital expenditures by integrating this functionality with the printer. The system has been designed to cope with the rigors of high volume SMT production, while incorporating the flexibility needed in high-mix, quick product set-up & changeover environments. Designed with ease of use & low cost of ownership in mind, the system utilises the most advanced drive control technology available, including 1 micron resolution Linear encoders on all axes, together with a suite of intuitive software that enables total control of the printing process.

nord

Semi-automatic screen printer UNIPRINT G023

It has a pneumatically tensioning ZelFlex Z4P 584 × 584 frame, which enables very precise paste application. The device has a visual correction system for applying solder paste, which has a huge impact on the entire assembly process.

 

nordRe-flow oven HOTFLOW 3 / 14e ERSA

Ersa Hotflow 3/14e Convection Reflow Oven is a high-quality oven, that offers exceptional soldering results thanks to its excellent thermal efficiency, even temperature distribution and separation of individual soldering zones. It has 7 heating zones and two cooling zones, which makes it possible to create ideal conditions for the correct soldering of electronic components. A temperature profile, optimal for a given product, is created before each new production batch. Thanks to the high class SEF Mysy 570,77 A profiler, we have the ability to choose a temperature profile, that meets the technical requirements of the Customer.

nord

Pick&Place Machine

The latest generation of the machine – the Japanese i-PULSE (Yamaha group) S20, with a capacity of 45000 cph, according to IPC 9850. It has a wide range of components from 0201 (inches) to 120 x 90mm, BGA, μBGA, TQFP. The machine is adapted to perform the role of the LED-Placer. Smart design allows the assembly of SMD components (including LEDs) on the PCB with a length of up to 1830 mm. This is a unique option in this class of machines. The S20 has a new generation of very fast and accurate Multi-Scan camera (High Speed & High Accuracy Fixed Camera). For the first time, it is possible that all SMD components, that are assembled by the machine, are processed by only one camera. Thanks to the high speed of image capture, the production process takes less time. The machine has 180 8mm feeder banks, which enables the assembly of modules with a large variety of components.

nord

Re-flow oven HOTFLOW 3/20e

Ersa Hotflow 3/20e Convection Reflow Oven is a high-quality oven, that offers exceptional soldering results thanks to its excellent thermal efficiency, even temperature distribution and separation of individual soldering zones. It has 10 heating zones and four cooling zones, which makes it possible to create ideal conditions for the correct soldering of electronic components. A temperature profile, optimal for a given product, is created before each new production batch. Thanks to the high class SEF Mysy 570,77 A profiler, we have the ability to choose a temperature profile, that meets the technical requirements of the Customer.

AOI

Automatic Optical Inspection is applied after SMT surface assembly. It is easy to spot any assembly errors then. Searches include short circuits, scratches, incorrect component or lack of it, bad polarity or component value. AOI EAGLE 4MP 8 inspects 100% PCBs in 2D and 3D technology. The combination of these two technologies allows to carry out a full, shadowless optical control of the assembled module, while maintaining high flexibility of the system.