Layers 2 – 24
Min. Board Thickness
2 layers 4 layers 6 layers 8 layers 10 layers
min. 0.2mm 0.40mm 1.00mm 1.20mm 1.50mm
12 & 14 layers 16 layers 18 layers 20 layers 22&24 layers
1.60mm 1.7mm 1.8mm 2.2mm 2.6mm
Max. Board Size 610 x 1200mm (24.0″ x 47.2″)
Base Material FR-4, Aluminium base, RCC
Surface Finish Treatment Immersion gold; HAL tin lead, leadfree; immersion silver
Via Holes Copper PTH / Blind Via / Buried Via
Copper Foil Thickness 18um / 35um / 70um ~ 245um (outerlayer:0.5oz~7oz)
18um / 35um / 70um ~ 210um (innerlayers:0.5oz~6oz)
Min. size of trace and pitch 0.075 mm / 0.10 mm (3 mil./ 4 mil.)
Min. size of vias and pads via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via
Solder Mask Liquid Photo-image (LPI)
Mechanical treatment CNC Routing, V-cutting, Punching,